From June 24 to 26, 2026, MWC Shanghai returned as scheduled. Under the annual theme "The IQ Era," the event spotlighted the deep integration of mobile AI across industries—a new frontier that is rapidly taking shape.

As one of the few Chinese companies with full-stack self-developed capabilities spanning storage controller  and modules, Konsemi made a strong presence at the Shanghai New International Expo Centre, showcasing its complete embedded storage controller portfolio. With a clear focus on the storage, Konsemi is building a solid foundation for the large-scale deployment of mobile AI.

Storage Empowers the AI Leap Forward

Looking back at the industry's evolution, the center of gravity is shifting decisively from building connectivity infrastructure to enabling intelligence at scale. The convergence of mobile and AI has become an irreversible core theme. Under the banner of "The IQ Era," Konsemi championed the message that "storage builds the foundation for AI," sending a clear signal: domestically developed storage controllers are now fully capable of supporting the growth of China's mobile AI industry.

Today, the biggest bottleneck for mobile AI deployment is not computing power—it's the constrained performance of on-device storage. Large language models, with billions or even tens of billions of parameters, rely on local storage for offline inference, placing heightened demands on capacity, bandwidth, and power consumption—especially in compact terminals like AI glasses and robots.

To address this, Konsemi's self-developed controllers are equipped with advanced error-correction algorithms and high-speed transmission architectures, ensuring fast model loading and smooth operation. The company has also launched a lightweight eMMC solution tailored for wearable devices, meeting their low-power and small-footprint requirements. Furthermore, Konsemi has successfully overcome two critical technical hurdles—multi-channel energy efficiency optimization and ultra-low-latency control—delivering a comprehensive storage supply capability that spans high-end, mid-range, and entry-level scenarios.

Proof of Strength Through Full-Stack Reality

At this year's exhibition, Konsemi presented its full portfolio of self-developed products, including high-performance eMMC 5.1 controller chips, miniaturized eMMC solutions for wearables, and UFS series modules.

What truly captured attendees' attention, however, were the live demonstrations featuring AI glasses, drones, and other smart devices powered by Konsemi's storage chips. These real-world showcases visibly demonstrated the chips' performance in high-bandwidth, low-latency, and high-reliability scenarios, drawing significant interest from industry professionals on-site.

From its early days focused on product introduction and market validation, Konsemi has now transitioned to a dual-driven strategy of performance breakthroughs and ecosystem collaboration. The company remains steadfast in its core of embedded storage controllers, executing a clear and resolute strategic roadmap.

As one of the few Chinese chip design houses capable of independently developing core IP, hardware SoC, firmware, and system-level solutions, Konsemi is dedicated to building the storage foundation required for the mass adoption of mobile AI. Whether in AI glasses, smartphones, or embodied robots, every on-device AI inference relies on stable, high-speed storage support—and that is precisely the core value Konsemi brings as it moves forward alongside its partners in the AI-driven era.

Independent and Controllable: Expanding the Ecosystem

Looking across the broader communications industry, two major trends have become irreversible: the full-scale commercial explosion of on-device AI, with embodied robots, AI phones, and drones accelerating deployment and pushing storage standards to new heights; and the deep reshaping of network architectures through AI-native networks and computing-network convergence.

As a critical upstream component supplier, Konsemi leverages its full-chain independent and controllable advantages. Its products are already compatible with major SoC platforms including MediaTek, Unisoc, HiSilicon, and Rockchip, and are widely used in smartphones, edge computing, and intelligent cockpits.

The multi-scenario demonstrations at this year's show—spanning AI glasses and industrial drones—also confirmed that Konsemi's storage solutions are rapidly expanding beyond consumer electronics into vertical sectors such as healthcare, education, and industrial applications. At its core, the widespread proliferation of mobile AI hinges on continuously upgraded storage capabilities—and Konsemi is standing at the forefront of this transformation.

Targeting High-End Innovation for the Next Iteration

2026 is widely regarded as a pivotal year for mobile AI, marking the transition from pilot trials to inclusive, large-scale empowerment.

Looking ahead to the next one to two years, Konsemi has set two core strategic goals:

First, iterating and upgrading product hardware capabilities. The company plans to launch a new generation of eMMC and UFS controller chips built on advanced process nodes in 2026, continuing to close the gap in high-end domestic storage controller technology.

Second, broadening and deepening the industrial ecosystem. Konsemi will sustain its dual-driven model of "performance breakthroughs + ecosystem collaboration," strengthening compatibility partnerships with major chip platforms and expanding its market presence and industry influence in cutting-edge scenarios such as AI edge devices, embodied robots, and automotive-grade hardware.

With MWC Shanghai as a key industry bellwether, Konsemi remains committed to its core storage mission. Through continuously iterated self-developed chips and a stable, reliable storage foundation, the company will accompany the mobile AI industry as it expands from consumer markets to diverse sectors across the economy—turning the vision of "The IQ Era" into reality with homegrown storage power.