From June 24 to 26, 2026, the Shanghai World Mobile Communications Congress (MWC Shanghai) was held. With the annual theme "The IQ Era," this year's congress focused on the new industrial landscape of deep mobile AI integration.

As one of the domestic enterprises with full-stack self-development capabilities in storage controller chips and modules, Konsemi appeared at the Shanghai New International Expo Center with a full set of embedded storage controller matrices, anchoring itself in the storage track and providing support for the large-scale implementation of mobile AI.

Storage Empowers AI Leap

Looking back at the industry's development history, the industry's focus is shifting comprehensively from building connectivity infrastructure to intelligent empowerment, and mobile AI integration has become an important trend. Under the congress theme of "The IQ Era," Konsemi adopted "storage as the foundation for AI" as its exhibition proposition, conveying a signal: domestic storage controllers are forming the capability to support the development of the domestic mobile AI industry.

At present, one of the important challenges in implementing mobile AI lies in matching end-side storage performance. Large model parameter scales are relatively large, and offline inference depends on local storage, placing higher requirements on capacity, bandwidth, and power consumption, especially in small terminals such as AI glasses and robots.

To this end, Konsemi's self-developed controller is equipped with error correction and high-speed transmission architecture, which helps large models load and run quickly; at the same time, it has launched a lightweight eMMC solution to adapt to the low-power, small-size needs of wearable devices, and has made technological progress in multi-channel high-energy-efficiency optimization and ultra-low-latency control, forming storage supply capabilities covering multiple scenarios from high-end to mid-range and low-end.

Full-Stack Real-Scenario Proof of Strength

At this exhibition, Konsemi focused on displaying full-stack self-developed products including high-performance eMMC 5.1 controller chips, miniaturized eMMC solutions suitable for wearable devices, and UFS series modules.

On site, real-scenario demonstrations were conducted through devices such as AI glasses, drones, and intelligent terminals equipped with Konsemi's self-developed storage chips, presenting the chips' actual performance in high-bandwidth, low-latency, and high-reliability scenarios, and attracting the attention of professional visitors on site.

From the early development stage focused on product introduction and market verification to now advancing performance breakthroughs and ecosystem collaboration, Konsemi has always adhered to the core track of embedded storage controllers. As one of the domestic chip design enterprises with complete self-development capabilities from core IP, hardware SoC, and firmware to systems, Konsemi is committed to building the storage power support needed for the large-scale implementation of mobile AI; whether it is AI glasses, smartphones, or embodied robots, every terminal AI inference is inseparable from storage support, and this is precisely where Konsemi's core value lies.

Independent and Controllable Ecosystem Expansion

Looking at the communications industry, two major trends have become relatively obvious: the comprehensive commercial advancement of end-side AI, with embodied robots, AI phones, and drones accelerating into implementation; and the deep development of AI-native networks and computing-network integration.

Positioned in the core component segment upstream of the industrial chain, Konsemi, with its full-chain independent and controllable advantages, has products already adapted to mainstream SoC platforms such as MediaTek, UNISOC, Huawei HiSilicon, and Rockchip, and widely used in devices such as mobile phones, edge computing, and smart cockpits.

The multi-scenario demonstrations at this exhibition, such as AI glasses and industrial drones, also indicate that Konsemi's storage solutions are expanding from consumer electronics to vertical industries such as healthcare, education, and industry. The foundation for the widespread popularization of mobile AI is essentially continuously upgrading storage power levels, and Konsemi is actively participating in this transformation process.

Anchoring High-End New Iteration

2026 is regarded by the industry as a key node for mobile AI to move from pilot experimentation toward inclusive empowerment.

For the next one to two years, Konsemi has established two core strategic goals:

First, iterate and upgrade product hardware. The company plans to launch a new generation of eMMC and UFS controller chips using advanced processes in 2026, continuously enhancing domestic high-end storage controller technological capabilities.

Second, deepen and broaden the industrial ecosystem. Konsemi continues its dual-driven model of "performance breakthrough + ecosystem collaboration," deepening adaptation cooperation with major mainstream chip platforms, and expanding market share and industry influence in cutting-edge scenarios such as AI edge devices, embodied robots, and automotive-grade hardware.

Based on MWC Shanghai, this industry bellwether, Konsemi will always adhere to its main storage business, and with continuously iterating self-developed chips and a stable storage power foundation, support the mobile AI industry in moving from the consumer end to all walks of life, contributing to the industrial blueprint of "The IQ Era."