During the exhibition, Konsemi, through physical product displays, scenario-based demonstrations, and one-on-one business negotiations, held in-depth discussions with upstream and downstream enterprises in the industrial chain on cutting-edge topics such as storage-computing collaboration and co-building of a domestically produced ecosystem. In the future, the company will continue to focus on the integrated circuit storage field, increase research and development investment, expand into high-end tracks such as automotive-grade and AI computing storage, promote the transformation of scientific research achievements from the laboratory to the production line, and, with an open and cooperative attitude, join hands with global partners to jointly break through industrial technological bottlenecks and help the development of the domestic storage ecosystem.
Full stack self-developed strength shining sword! Konsemi showcases innovative storage solutions at MTS2026!
On November 27, 2025, the MTS2026 Storage Industry Trend Seminar hosted by TrendForce was held in Shenzhen. Hefei Konsemi Storage Technology Co., Ltd. (hereinafter referred to as "Konsemi"), a domestic embedded memory controller chip and solution provider, exhibited at the event, bringing its fully self-developed eMMC 5.1, small-size eMMC, and UFS series core products as well as domestically produced storage solutions, showcasing from multiple aspects its technological progress and industrialization achievements in consumer-grade, industrial-grade, and automotive-grade fields, and injecting new momentum into the development of the storage industry in the AI era.

As one of the domestic chip design companies with full-stack self-development capabilities from core IP, hardware SoC, and firmware to systems, Konsemi's exhibited products at this event embodied three major characteristics: "high performance, high reliability, and broad compatibility."
Star Products on Display
The exhibited eMMC 5.1 embedded memory chip became the focus of attention at the site, with capacities ranging from 8GB to 256GB. The product supports the HS400 high-speed transmission standard and performs well in operating speed and later-stage smoothness; it features functions such as power-off protection and bad block monitoring, which help improve product stability; it has strong error correction capability and adopts advanced algorithms. The product can be widely used in fields such as smartphones, smart TVs, tablets, set-top boxes, projectors, wearable devices, robots, automobiles, and AI computing edge devices; the product has completed multi-faceted compatibility certification with mainstream platforms such as MediaTek, UNISOC, Huawei HiSilicon, Amlogic, Rockchip, Allwinner, and Eeasytech.




New Products Unveiled
In response to the miniaturization and low power consumption needs of wearable devices, Konsemi also exhibited small-size eMMC and UFS products. The compact design and low power consumption performance of the small-size eMMC make it suitable for terminal products such as AI glasses and smart watches.
Among them, the UFS series products also attracted attention, supporting new functions such as Write Booster, DeepSleep, and Performance Throttling Notification, with a transmission speed of 23.2Gbps, supporting flash memory capacities from 256GB to 1TB, and suitable for various scenarios such as smartphones, drones, and automotive electronics.

Among them, the UFS series products also received much attention, supporting new functions such as Write Booster, DeepSleep, and Performance Throttling Notification, with a transmission speed of up to 23.2Gbps, supporting flash memory capacities from 256GB to 1TB, and suitable for various scenarios such as smartphones, drones, and automotive electronics.

Storage Expansion Plans
It is reported that Konsemi has begun laying out UFS 3.1 products. Regarding the next research and development priorities, Su Junjie, Deputy General Manager, stated that Konsemi will focus on two major directions: "performance" and "ecosystem." In UFS 3.1 research and development, priority will be given to tackling "high energy efficiency ratio optimization under multi-channel architecture" and "ultra-low latency control technology," aiming to enable next-generation products to better meet the power consumption requirements of high-end mobile phones and other devices while providing higher transmission rates.

At present, Konsemi is vigorously expanding the robot memory and industrial control-grade memory markets. Taking cooperation with a domestic advanced industrial robot manufacturer as an example, Su Junjie specifically explained two major challenges: first, the new generation of collaborative robots needs to read and write massive amounts of environmental and motion data in real time and uninterruptedly, placing high requirements on memory stability and durability; second, the industrial site environment is complex, with electromagnetic interference and temperature variations. This requires storage products to meet high standards in anti-interference, wide-temperature adaptability, and data reliability.
Based on this, Konsemi provides an industrial-grade eMMC embedded storage module solution. This solution is equipped with the company's self-developed controller chip and firmware, and through strengthening the LDPC error correction algorithm, adding power-off protection (PPL), and bad block monitoring management technologies, it helps improve data integrity and product reliability under complex electromagnetic environments and frequent power-off risks.


