Hefei Konsemi Completes Another Successful Market-oriented Financing of 130 Million Yuan
Recently, Hefei Konsemi Storage Technology Co., Ltd. (hereinafter referred to as "Konsemi") successfully completed 130 million yuan in market-oriented financing. This was the second round of financing after the 192 million yuan Series A financing completed in March 2022, and the financing amount exceeded the original expectation of 100 million yuan. A total of 8 well-known industrial companies and professional investors, including CITIC Securities, Huafu, and Haiyue, jointly participated in the capital increase, with a post-investment valuation of nearly 1 billion yuan.
The memory controller chip industry in which Konsemi operates has a huge market, but it has been occupied by international giants such as Samsung, SK Hynix, and Intel for many years. At present, there are about 10-plus enterprises with independent design and mass production capabilities, and the localization rate is less than 1%. As the embedded controller chip with relatively high technical difficulty among memory controller chips, both its development difficulty and the difficulty of introduction into brand customers are high. In the past, many domestic companies attempted to develop such products, but most ended in failure.
Konsemi was established in November 2018, with the research and development of memory controller chips and memory modules as its main business. It is one of the few domestic manufacturers capable of independently designing a full series of embedded memory controller chips. After nearly five years of development, Konsemi has recruited technical teams at home and abroad. Through the collaborative efforts of core members (all of whom have many years of industry experience and technical research and development capabilities), Konsemi's self-developed eMMC products have completed compatibility certification with mainstream manufacturers such as Huawei HiSilicon, UNISOC, Intel, MediaTek, Amlogic, and Rockchip. Its products have entered the supply chains of brands such as Konka, ZTE, Jiulian, and Hisense. At the same time, it has established a fully domestically produced supply chain guarantee system, with everything from chip design to wafer foundry to packaging and testing completed in China. Konsemi's products cover multiple fields including consumer-grade, automotive-grade, and industrial-grade applications, and can be widely used in law enforcement recorders, new energy vehicles, drones, telemedicine, industrial robots, consumer electronics, and other fields, holding positive significance in areas such as national storage security, industrial and agricultural production, firefighting and emergency response, and military and aerospace.
Under the current environment of China-U.S. trade disputes and the country's strengthening of technological innovation and industrial upgrading, Konsemi will lock onto its goals, actively forge ahead, and contribute new strength to the development of the national memory industry and an independently controllable supply chain, as well as to the achievement of the group's strategy driven by technological innovation.

