China storage master chip
Design practitioner
Hefei Konsemi Storage Technology Co.,Ltd. was established in November 2018. Headquartered in the Hefei Economic and Technological Development Zone, Anhui Province, with branch offices in Shenzhen and Shanghai, the company is a high-tech enterprise specializing in flash memory controller chips and embedded storage solutions.
With embedded storage controller technology as its strategic core, Konsemi is one of the few Chinese storage chip design companies that possesses full-stack in-house R&D capabilities encompassing "IP development, hardware design, firmware development, and system development." From core IP to volume production, the company has achieved end-to-end independent control over the entire storage controller chip value chain. Through continuous deep cultivation in the storage field, Konsemi is committed to delivering high-quality, high-efficiency storage products and services to customers across various industries.
Konsemi's self-developed eMMC controller chips and storage modules have gained broad market recognition and have been deeply embedded into the core scenarios of consumer electronics and industrial intelligence. From traditional terminals such as smartphones and smart TVs, to high-reliability fields including automotive electronics, security surveillance, and industrial control, and further to emerging hardware like 3D printers, drones, AI edge computing, and AI-powered smart terminal devices, the company's storage solutions provide a solid foundation for intelligent upgrades across diverse application scenarios with high compatibility and stable performance.
As a National High-Tech Enterprise and a National-Level "Little Giant" Specialized and Sophisticated Enterprise, Konsemi leverages its strong technological innovation and industrialization capabilities to empower the AI era, and is emerging as a key driving force in advancing domestic substitution within China's storage industry.

- 01Consumer grade storage
- 02Industrial grade storage
- 03Vehicle grade storage
- 04Customized design services
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2026-04-07Intelligent Innovation Boundless and Chip Towards the Future | Konsemi Invited to Attend the 2026 Semiconductor Industry Development Trend Conference and Deliver a keynote Speech -
2025-11-27Full stack self-developed strength shining sword! Konsemi showcases innovative storage solutions at MTS2026! -
2026-07-13Konsemi Shines at AI+AR Glasses Salon: Decoding How Storage Chips Redefine Terminal Boundaries





