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Intelligent Innovation Boundless and Chip Towards the Future | Konsemi Invited to Attend the 2026 Semiconductor Industry Development Trend Conference and Deliver a keynote Speech
On April 10, 2026, Konsemi will attend the "2026 Semiconductor Industry Development Trends Conference" hosted by Huaqiang Electronic Network, and will deliver a keynote speech at the "AI Empowering Consumer Electronics Innovation and Application Forum" jointly hosted by the IICIE International Integrated Circuit Innovation Expo, the Shenzhen Artificial Intelligence Industry Association, and Huaqiang Electronic Network. Liang Huaihua, General Manager of the Market Planning Department, will share the opportunities and breakthroughs for domestic embedded storage under the AI wave.
Speech Summary
AI technology is exploding across all domains, profoundly reconstructing the demand logic of the storage industry. Changes in the global storage market supply and demand landscape are driving the industry's prosperity to continue rising — this is a golden window period for the domestic storage industry, and even more a key opportunity for embedded storage enterprises to achieve technological breakthroughs and domestic localization.
Liang Huaihua will combine Konsemi's years of technological accumulation and rich industrial practice in the embedded storage field to deeply interpret the core changes in storage demand in the AI era, the market opportunities for domestic storage, the path to technological breakthroughs, and domestic localization strategies. Based on industry pain points and corporate practice, she will provide practical and feasible references and lessons for the development of the domestic embedded storage industry.
Time: April 10, 2026 (Friday)
Venue: Madrid Hall 2, InterContinental Shenzhen OCT Hotel
Industry colleagues are cordially invited to attend! Join Konsemi in seizing the dual opportunities of AI and domestic substitution, and jointly explore new blue oceans for the industry!
This conference is hosted by Huaqiang Electronic Network, with the theme "Smart Innovation Without Boundaries · Chips Toward the Future," focusing on three core topics: digital-intelligent empowerment, domestic substitution, and collaborative development. It will share full-chain practical solutions from design, manufacturing to procurement and distribution, jointly explore technology integration paths and domestic substitution strategies, aiming to use digital-intelligentization to break through industrial bottlenecks and march together toward a new journey of high-quality semiconductor development.
At that time, the conference will gather elites from the entire industrial chain, including chip design, manufacturing, procurement, and distribution, and will present on-site awards such as the "2025 (18th) Huaqiang Electronic Network Quality Suppliers and Outstanding Domestic Brands" to set industry benchmarks.
